Technical Capability

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Feature

Details

Monthly Capability

6000type\monthly,10000㎡\monthly

Printed Circuits

Single-sided,double-sided PTH,Multi-layer (up to 20 layers),aluminum boards

Base Material

FR4,Rogers,CEM1,CEM3,94HB,94V0

Surface Finish

OPS(ENTEK),HAL,Leadfree HASL,ENIG(Immersion Gold),Immersion Tin,Immersion Sliver,Hard Gold,Platting Gold,Gold Finger,ENEPIG

Max Circuit Range

1 – 2 sided 600 x 1000mm, Multilayer 600 x 600mm

Board Thickness

1 – 2 0.2-7.0mm, Multilayer 0.4-7.0mm

Min Hole Size

0.15mm For Mechanical drill,0.1mm For Laser Drill

Min Line Width\Gap

3.5\4mil

Min Annular Ring

4mil

Max Copper Thickness

12oz

Min Solder Mask Bridge

0.08mm

Aspect Raion

15:1

Plugging Vias Capability

0.2-0.8mm

Solder Mask

Blue,White,Red,Blue,Green

Silkscreen

Whit,Black

Bare Board Test

Flying Probe(On request)

Contour

Rount-singly or in panel scored(CNC scoring)

Data Format

Gerber,Gerber RS274, RS274X, DXF, HPGL,ODB++

Prototype Lead Time

From 24 hours to 3 working days

Production Lead Time

From 3 working days to 15 working days